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Dr. Vinay K. Srivastava, Associate Professor, Department of MBA, attended the 6th International Summit for Packaging Industry (ISPI-2026) as a Special Guest, organized by the Indian Institute of Packaging on March 14, 2026 at the Eros Hotel. The summit, held from March 12–14, 2026, brought together global leaders, industry experts, policymakers, academicians, and innovators to deliberate on the evolving future of the packaging industry.




The summit, themed “Packaging 5S-AI – Safe, Secure, Standardized, Smart, Sustainable and Artificial Intelligence,” brought together global experts and industry leaders to deliberate on innovations in smart packaging, sustainability, automation, and AI-driven technologies shaping the future of the packaging industry.
It was a valuable and enriching experience to gain insights from industry leaders and participate in discussions on emerging trends and global best practices in the packaging sector.